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Digital processor array implementation aspects of a 3D multi-layer vision architecture

AuthorsFöldesy, P.; Carmona-Galán, R. ; Rekeczky, Csaba; Zarandy, A.; Rodríguez-Vázquez, Ángel ; Roska, Tamás
Issue Date2010
PublisherInstitute of Electrical and Electronics Engineers
Citation12th International Workshop on Cellular Nanoscale Networks and Their Applications (CNNA): 1-4 (2010)
AbstractTechnological aspects of the 3D integration of a multilayer combined mixed-signal and digital sensor-processor array chip is described. The 3D integration raises the question of signal routing, power distribution, and heat dissipation, which aspects are considered systematically in the digital processor array layer as part of the multi layer structure. We have developed a linear programming based evaluation system to identify the proper architecture and its parameters.
DescriptionTrabajo presentado al 12th CNNA celebrado en Berkeley (USA) del 3 al 5 de febrero de 2010.
Publisher version (URL)http://dx.doi.org/10.1109/CNNA.2010.5430274
Identifiersdoi: 10.1109/CNNA.2010.5430274
isbn: 978-1-4244-6679-5
Appears in Collections:(IMSE-CNM) Libros y partes de libros
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