English   español  
Please use this identifier to cite or link to this item: http://hdl.handle.net/10261/76685
Share/Impact:
Statistics
logo share SHARE   Add this article to your Mendeley library MendeleyBASE
Visualizar otros formatos: MARC | Dublin Core | RDF | ORE | MODS | METS | DIDL
Exportar a otros formatos:
Title

A study of the corrosive effect of soldering fluxes on printed circuit boards: Six corrosions tests were evaluated as to their effectiveness in assessing the corrosive characteristics of commercial rosins used in the electronics industry

AuthorsGalván Sierra, Juan Carlos; Bastidas Rull, José María; Feliú Batlle, Sebastián
Issue Date1996
PublisherAmerican Welding Society
CitationWelding Journal (Miami, Fla) 75: 366s-371s (1996)
AbstractThe corrosiveness of six commercial rosins used by the electronics industry was studied. The copper sheet test, drop test and copper electrodeposition test were used. The chloride content, pH and conductivity of the aqueous rosin extracts were determined. Finally, the electrochemical impedance spectroscopy (EIS) method was used. All six tests allowed rosin corrosiveness to be studied. The EIS method allowed the corrosion rate to be quantified.
URIhttp://hdl.handle.net/10261/76685
Identifiersissn: 0043-2296
http://www.aws.org/wj/supplement/WJ_1996_11_s366.pdf
Appears in Collections:(CENIM) Artículos
Files in This Item:
File Description SizeFormat 
accesoRestringido.pdf15,38 kBAdobe PDFThumbnail
View/Open
Show full item record
Review this work
 


WARNING: Items in Digital.CSIC are protected by copyright, with all rights reserved, unless otherwise indicated.