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Integrated Ferroelectrics for Sensor and Capacitor Applications

AutorPatel, A.
Palabras claveThin films
Fecha de publicación1998
EditorSociedad Española de Cerámica y Vidrio
CitaciónBoletín de la Sociedad Española de Cerámica y Vidrio. Vol. 37 Núms. 2-3 Marzo-junio 1998
ResumenFerroelectric materials have a unique range of properties such as high dielectric constant, pyroelectricity and piezoelectricity, which have enabled a host of diverse applications to be realized. The combination of ferroelectric materials as thin film with the developing field of micromachining has led to new and novel device applications. Although there are several routes available for thin film fabrication, e.g: Solution, MOCVD, etc., the solution approach in particular appeals as a simple process compatible with existing semiconductor processing equipment. This approach offers a route to low cost wafer scale fabrication, with potential for improved performance. At GMIRL, materials compositions within the PZT (PbZr^Ti|_^03) solid solution system have been systematically investigated using a modified spin-coating deposition method, for applications in 2-D uncooled pyroelectric arrays and in MCM-D decoupling capacitors. In addition, use of the techniques of X-ray diffraction (XRD), Auger Analysis (AES) and Transmission and Scanning Electron Microscopy (TEM/STEM) has given considerable in-sight into structure determination, film honaogeneity, and formation activation energy for the PZT (30/70) composition in particular.
Versión del editorBoletín de la Sociedad Española de Cerámica y Vidrio. Vol. 37 Núms. 2-3 Marzo-junio 1998
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