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A method to investigate the electron scattering characteristics of ultrathin metallic films by in situ electrical resistance measurements

AuthorsFermento, Rui
Issue Date2009
PublisherAmerican Physical Society
CitationReview of Scientific Instruments 80: 073909 (2009)
AbstractIn this article, a method to measure the electrical resistivity/conductivity of metallic thin films during layer growth on specific underlayers is described. The in situ monitoring of an underlayer electrical resistance, its change upon the incoming of new material atoms/molecules, and the growth of a new layer are presented. The method is easy to implement and allows obtaining in situ experimental curves of electrical resistivity dependence upon film thickness with a subatomic resolution, providing insight in film growth microstructure characteristics, specular/diffuse electron scattering surfaces, and optimum film thicknesses.
DescriptionR. Fermento et al.
Publisher version (URL)http://dx.doi.org/10.1063/1.3186059
Appears in Collections:(IMN-CNM) Artículos
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