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Título

Copper corrosion mechanism in the presence of formic acid vapor for short exposure times

AutorBastidas Rull, José María; López-Delgado, Aurora ; Cano Díaz, Emilio ; Polo, J. L.; López Gómez, Félix Antonio
Palabras claveCooper corrosion
Formic acid vapor
Gravimetric method
Fecha de publicación2000
EditorElectrochemical Society
CitaciónJournal Electrochemical Society 147 (3) : 999-1005 (2000)
ResumenThe rate of copper corrosion originated by the action of formic acid vapors at 100% relative humidity was studied. Five formic vapor concentration levels (10, 50, 100, 200, and 300 ppm) were used. A copper corrosion rate of up to 1300 mg/m2 d was measured for a period of 21 days using a gravimetric method. The patina layers were characterized using cathodic reduction, X-ray powder diffraction, Fourier transform infrared spectrometry, and scanning electron microscopy techniques. Some of the components identified in the corrosion-product layers were cuprite (Cu2O), cupric hydroxide hydrate [Cu(OH)2·H2O], and copper formate hydrate [Cu(HCOO)2·4H2O]. The latter was formed by both cupric hydroxide and formic acid-cuprous ion complex mechanisms.
Versión del editorhttp://scitation.aip.org/getpdf/servlet/GetPDFServlet?filetype=pdf&id=JESOAN000147000003000999000001&idtype=cvips&prog=normal
URIhttp://hdl.handle.net/10261/45221
DOI10.1149/1.1393303
ISSN0013-4651
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