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Thermal fatigue effects on the temperature distribution inside IGBT modules for zone engine aeronautical applications

AuthorsLhommeau, T.; Perpiñà, X.; Martín, C.
Issue Date2007
CitationMicroelectronics Reliability 47(9-11): 1779-1783 (2007)
AbstractThis work examines the thermal fatigue effects on the temperature distribution inside IGBT modules for aeronautical applications. Exactly, they are used in a very different application where temperature cycling due to the working environment is the most limiting fact. In this case, it is concluded that solder delamination does not present any restriction to module lifetime at short term (up to 60% of total delaminated area). In addition, it is proposed only determining the delaminated area behind devices, which is the main responsible of the thermal temperature increase.
Description5 páginas, 8 figuras.-- Trabajo presentado al 18th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis.-- et al.
Publisher version (URL)http://dx.doi.org/10.1016/j.microrel.2007.07.093
Appears in Collections:(IMB-CNM) Artículos
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