English   español  
Please use this identifier to cite or link to this item: http://hdl.handle.net/10261/219653
logo share SHARE logo core CORE   Add this article to your Mendeley library MendeleyBASE

Visualizar otros formatos: MARC | Dublin Core | RDF | ORE | MODS | METS | DIDL | DATACITE
Exportar a otros formatos:


Microstructure and thermal conductivity of Si-Al-C-O fiber bonded ceramics joined to refractory metals

AuthorsVera, M.C. ; Martínez-Fernández, J.; Singh, M.; Casalegno, V.; Balagna, C.; Ramirez-Rico, J.
KeywordsSilicon carbide
Thermal conductivity
Issue Date2020
CitationMaterials Letters 276: 12863 (2020)
AbstractWe explore joining Si-Al-C-O fiber-bonded ceramics to Cu-clad-Mo using an Ag-Ti-Cu brazing alloy. A temperature of 900 °C and times in the range of 10–20 min are required to obtain sound joints irrespectively of the fiber orientation. The reaction layer is 1–2 μm thick and free of pores and defects. The thermal conductivity of the joined samples is well described considering that the metal and the ceramic are in series for thermal resistance. This implies that the joint is highly conductive and forms an almost perfect thermal interface between the two materials, confirming the quality of the obtained brazing layer.
Publisher version (URL)http://dx.doi.org/10.1016/j.matlet.2020.128203
Identifiersdoi: 10.1016/j.matlet.2020.128203
issn: 1873-4979
Appears in Collections:(ICMS) Artículos
Files in This Item:
File Description SizeFormat 
MLBLUE-D-20-01293_Manuscript.pdf Embargoed until June 25, 20211,26 MBAdobe PDFThumbnail
View/Open    Request a copy
Show full item record
Review this work

WARNING: Items in Digital.CSIC are protected by copyright, with all rights reserved, unless otherwise indicated.