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Enhancement of Thermal Boundary Conductance of Metal–Polymer System

AuthorsSandell, Susanne; Maire, Jeremie; Chávez-Ángel, Emigdio; Sotomayor Torres, Clivia M.; Kristiansen, Helge; Zhang, Zhiliang; He, Jianying
Issue Date2-Apr-2020
PublisherMultidisciplinary Digital Publishing Institute
CitationNanomaterials 10 (4): 670 (2020)
AbstractIn organic electronics, thermal management is a challenge, as most organic materials conduct heat poorly. As these devices become smaller, thermal transport is increasingly limited by organic&ndash;inorganic interfaces, for example that between a metal and a polymer. However, the mechanisms of heat transport at these interfaces are not well understood. In this work, we compare three types of metal&ndash;polymer interfaces. Polymethyl methacrylate (PMMA) films of different thicknesses (1&ndash;15 nm) were spin-coated on silicon substrates and covered with an 80 nm gold film either directly, or over an interface layer of 2 nm of an adhesion promoting metal&mdash;either titanium or nickel. We use the frequency-domain thermoreflectance (FDTR) technique to measure the effective thermal conductivity of the polymer film and then extract the metal&ndash;polymer thermal boundary conductance (TBC) with a thermal resistance circuit model. We found that the titanium layer increased the TBC by a factor of 2, from 59 &times; 10<sup>6</sup> W&middot;m<sup>&minus;2</sup>&middot;K<sup>&minus;1</sup> to 115 &times; 10<sup>6</sup> W&middot;m<sup>&minus;2</sup>&middot;K<sup>&minus;1</sup>, while the nickel layer increased TBC to 139 &times; 10<sup>6</sup> W&middot;m<sup>&minus;2</sup>&middot;K<sup>&minus;1</sup>. These results shed light on possible strategies to improve heat transport in organic electronic systems.
Identifiersdoi: 10.3390/nano10040670
Appears in Collections:Colección MDPI
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