English   español  
Please use this identifier to cite or link to this item: http://hdl.handle.net/10261/189290
Share/Impact:
Statistics
logo share SHARE logo core CORE   Add this article to your Mendeley library MendeleyBASE

Visualizar otros formatos: MARC | Dublin Core | RDF | ORE | MODS | METS | DIDL
Exportar a otros formatos:

Title

Deconstructing temperature gradients across fluid interfaces: the structural origin of the thermal resistance of liquid-vapor interfaces

AuthorsMuscatello, Jordan; Chacón, Enrique ; Tarazona, Pedro; Bresme, Fernando
Issue Date28-Jul-2017
PublisherAmerican Physical Society
CitationPhysical Review Letters 119(4): 045901 (2017)
AbstractThe interfacial thermal resistance determines condensation-evaporation processes and thermal transport across material-fluid interfaces. Despite its importance in transport processes, the interfacial structure responsible for the thermal resistance is still unknown. By combining nonequilibrium molecular dynamics simulations and interfacial analyses that remove the interfacial thermal fluctuations we show that the thermal resistance of liquid-vapor interfaces is connected to a low density fluid layer that is adsorbed at the liquid surface. This thermal resistance layer (TRL) defines the boundary where the thermal transport mechanism changes from that of gases (ballistic) to that characteristic of dense liquids, dominated by frequent particle collisions involving very short mean free paths. We show that the thermal conductance is proportional to the number of atoms adsorbed in the TRL, and hence we explain the structural origin of the thermal resistance in liquid-vapor interfaces.
Publisher version (URL)https://doi.org/10.1103/PhysRevLett.119.045901
URIhttp://hdl.handle.net/10261/189290
Identifiersdoi: 10.1103/PhysRevLett.119.045901
issn: 0031-9007
e-issn: 1079-7114
Appears in Collections:(ICMM) Artículos
Files in This Item:
File Description SizeFormat 
accesoRestringido.pdf15,38 kBAdobe PDFThumbnail
View/Open
Show full item record
Review this work
 

Related articles:


WARNING: Items in Digital.CSIC are protected by copyright, with all rights reserved, unless otherwise indicated.