English   español  
Please use this identifier to cite or link to this item: http://hdl.handle.net/10261/182249
Share/Impact:
Statistics
logo share SHARE   Add this article to your Mendeley library MendeleyBASE
Visualizar otros formatos: MARC | Dublin Core | RDF | ORE | MODS | METS | DIDL
Exportar a otros formatos:

DC FieldValueLanguage
dc.contributor.authorCaballero-Calero, Olgaes_ES
dc.contributor.authorRuiz-Clavijo, Alejandraes_ES
dc.contributor.authorPérez Taborda, Jaime Andréses_ES
dc.contributor.authorVera Londono, Liliana Patriciaes_ES
dc.contributor.authorResende, Pedro M.es_ES
dc.contributor.authorSanz González, Ruyes_ES
dc.contributor.authorRull Bravo, Martaes_ES
dc.contributor.authorAbad Mayor, Begoñaes_ES
dc.contributor.authorMuñoz Rojo, Migueles_ES
dc.contributor.authorMartín-González, Marisoles_ES
dc.date.accessioned2019-05-24T07:55:26Z-
dc.date.available2019-05-24T07:55:26Z-
dc.date.issued2017-03-07-
dc.identifier.citationNanospain (2017)es_ES
dc.identifier.urihttp://hdl.handle.net/10261/182249-
dc.descriptionTrabajo presentado en el Nanospain, celebrado en San Sebastian (España), del 7 al 10 de marzo de 2017es_ES
dc.description.abstractThermoelectric materials are able to convert a gradient of temperature in a diference of voltage, or vice versa. In order to improve the thermoelectric efficiency of these materials for actual applications, one of the most studied routes is the reduction in the dimensionality, via nanowire fabrication, for instance. This gives rise to a reduction of the thermal conductivity of the material due to the increase of phonon dispersion in the surface of the nanowires [1]. Another route to decrease the thermal conductivity would be the fabrication of interconnected three-dimensional structures, which could be seen as an intricate net of nanowires with many connection points, which increases the phonon dispersion and thus reduces the thermal conductivty. We will review these kinds of structures along with the latest developments of template assisted electrochemical deposition of thermoelectric materials in three-dimensional templates. In this case, the reduction in thermal conductivity is due to the resulting interconnected three-dimensional structure that enhances the phonon scattering; compared with bulk, thin films or nanowires.es_ES
dc.language.isoenges_ES
dc.rightsclosedAccesses_ES
dc.titleNew developments on Thermoelectric materials: reducing scale and dimensionalityes_ES
dc.typecomunicación de congresoes_ES
dc.description.peerreviewedPeer reviewedes_ES
dc.relation.csices_ES
oprm.item.hasRevisionno ko 0 false*
Appears in Collections:(IMN-CNM) Comunicaciones congresos
Files in This Item:
File Description SizeFormat 
accesoRestringido.pdf15,38 kBAdobe PDFThumbnail
View/Open
Show simple item record
 


WARNING: Items in Digital.CSIC are protected by copyright, with all rights reserved, unless otherwise indicated.