English   español  
Please use this identifier to cite or link to this item: http://hdl.handle.net/10261/132200
Share/Impact:
Statistics
logo share SHARE logo core CORE   Add this article to your Mendeley library MendeleyBASE

Visualizar otros formatos: MARC | Dublin Core | RDF | ORE | MODS | METS | DIDL
Exportar a otros formatos:
Title

Thermal conductivity measurements of high and low thermal conductivity films using a scanning hot probe method in the 3ω mode and novel calibration strategies

AuthorsWilson, Adam Andrew; Muñoz Rojo, Miguel ; Abad Mayor, Begoña ; Pérez Taborda, Jaime Andrés ; Maiz, Jon ; Schomacker, Jason; Martín-González, Marisol; Borca Tasciuc, Diana-Andra; Borca Tasciuc, Theodorian
Issue Date2015
PublisherRoyal Society of Chemistry (UK)
CitationNanoscale 7: 15404-15412 (2015)
AbstractThis work discusses measurement of thermal conductivity (k) of films using a scanning hot probe method in the 3ω mode and investigates the calibration of thermal contact parameters, specifically the thermal contact resistance (RthC) and thermal exchange radius (b) using reference samples with different thermal conductivities. RthC and b were found to have constant values (with b = 2.8 ± 0.3 μm and Rthc = 44 927 ± 7820 K W−1) for samples with thermal conductivity values ranging from 0.36 W K−1 m−1 to 1.1 W K−1 m−1. An independent strategy for the calibration of contact parameters was developed and validated for samples in this range of thermal conductivity, using a reference sample with a previously measured Seebeck coefficient and thermal conductivity. The results were found to agree with the calibration performed using multiple samples of known thermal conductivity between 0.36 and 1.1 W K−1 m−1. However, for samples in the range between 16.2 W K−1 m−1 and 53.7 W K−1 m−1, calibration experiments showed the contact parameters to have considerably different values: Rthc = 40 191 ± 1532 K W−1 and b = 428 ± 24 nm. Finally, this work demonstrates that using these calibration procedures, measurements of both highly conductive and thermally insulating films on substrates can be performed, as the measured values obtained were within 1–20% (for low k) and 5–31% (for high k) of independent measurements and/or literature reports. Thermal conductivity results are presented for a SiGe film on a glass substrate, Te film on a glass substrate, polymer films (doped with Fe nano-particles and undoped) on a glass substrate, and Au film on a Si substrate. © 2015 The Royal Society of Chemistry.
Publisher version (URL)http://dx.doi.org/10.1039/c5nr03274a
URIhttp://hdl.handle.net/10261/132200
DOI10.1039/c5nr03274a
Identifiersissn: 2040-3372
Appears in Collections:(IMN-CNM) Artículos
Files in This Item:
File Description SizeFormat 
accesoRestringido.pdf15,38 kBAdobe PDFThumbnail
View/Open
Show full item record
Review this work
 

Related articles:


WARNING: Items in Digital.CSIC are protected by copyright, with all rights reserved, unless otherwise indicated.