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Por favor, use este identificador para citar o enlazar a este item: http://hdl.handle.net/10261/118305
Título

From an organometallic monolayer to an organic monolayer covered by metal nanoislands: A simple thermal protocol for the fabrication of the top contact electrode in molecular electronic devices

AutorBallesteros, Luz M.; Martín, Santiago; Pérez Murano, Francesc; Low, Paul J.; Cea, Pilar
Palabras claveTop-contact electrode
Molecular junction
Langmuir-blodgett films
Fecha de publicación2014
EditorWiley-VCH
CitaciónAdvanced Materials Interfaces 1(9): 1400128 (2014)
ResumenIn this contribution, a novel method for practical uses in the fabrication of the top contact electrode in a metal/organic monolayer/metal device is presented. The procedure involves the thermally induced decomposition of an organometallic compound, abbreviated as the TIDOC method. Monolayers incorporating the metal organic compounds (MOCs) [[4-{(4-carboxy)ethynyl}phenyl]ethynyl]-(triphenylphosphine)-gold, 1, or [1-isocyano-4-methoxybenzene]-[4-amino-phenylethynyl]-gold, 2, were annealed at moderate temperatures (1: 150 °C for 2h and 2: 100 °C for 2 h), resulting in cleavage of the Au-P or Au-C bond and reduction of Au(I) to Au(0) as metallic gold nanoparticles (GNPs). These particles are distributed on the surface of the film resulting in formation of metal/molecule/GNP sandwich structures. Electrical properties of these nascent devices were determined by recording I¿V curves with a conductive-AFM. The I¿V curves collected from these metal/organic monolayer/GNPs sandwich structures are typical of metal-molecule-metal junctions, with no low resistance traces characteristic of metallic short circuits observed over a wide range of set-point forces. The TIDOC method is therefore an effective procedure for the fabrication of molecular junctions for the emerging area of molecular electronics.
Descripciónet al.
Versión del editorhttp://dx.doi.org/10.1002/admi.201400128
URIhttp://hdl.handle.net/10261/118305
DOI10.1002/admi.201400128
Identificadoresdoi: 10.1002/admi.201400128
e-issn: 2196-7350
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