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Please use this identifier to cite or link to this item: http://hdl.handle.net/10261/45221
Title: Copper corrosion mechanism in the presence of formic acid vapor for short exposure times
Authors: Bastidas Rull, José María; López-Delgado, Aurora; Cano Díaz, Emilio; Polo, J. L.; López Gómez, Félix Antonio
Keywords: Cooper corrosion
Formic acid vapor
Gravimetric method
Issue Date: 2000
Publisher: Electrochemical Society
Citation: Journal Electrochemical Society 147 (3) : 999-1005 (2000)
Abstract: The rate of copper corrosion originated by the action of formic acid vapors at 100% relative humidity was studied. Five formic vapor concentration levels (10, 50, 100, 200, and 300 ppm) were used. A copper corrosion rate of up to 1300 mg/m2 d was measured for a period of 21 days using a gravimetric method. The patina layers were characterized using cathodic reduction, X-ray powder diffraction, Fourier transform infrared spectrometry, and scanning electron microscopy techniques. Some of the components identified in the corrosion-product layers were cuprite (Cu2O), cupric hydroxide hydrate [Cu(OH)2·H2O], and copper formate hydrate [Cu(HCOO)2·4H2O]. The latter was formed by both cupric hydroxide and formic acid-cuprous ion complex mechanisms.
Publisher version (URL): http://scitation.aip.org/getpdf/servlet/GetPDFServlet?filetype=pdf&id=JESOAN000147000003000999000001&idtype=cvips&prog=normal
URI: http://hdl.handle.net/10261/45221
ISSN: 0013-4651
DOI: 10.1149/1.1393303
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