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Process for preparing a polymeric relief structure

AuthorsBastiaansen, Cees; Broer, Dirk, J.; Sánchez-Somolinos, Carlos
Issue Date17-Aug-2006
CitationInternational Publication Number: WO 2006/085757 A3
AbstractThe present invention relates to a process for the preparation of a polymeric relief structure by a) coating a substrate with a first coating composition comprising one or more radiation-sensitive ingredients, d) locally treating the coated substrate with electromagnetic radiation having a periodic or random radiation-intensity pattern, forming a latent image, e) polymerizing and/or crosslinking the resulting coated substrate to a first coating. This process is improved by applying a second coating composition on top of the first coating composition, said second coating composition comprising either an organic compound (Co) of a monomeric nature and wherein Co is also polymerized during the process, or wherein said second coating comprises a dissolved polymer (Cp). As a result a polymeric relief structure is obtained, where a substrate is coated with a functional, stacked, bi-layer, in which each layer exhibits a specific, and from each other differing function.
DescriptionFiling Date: 2006-02-09. --Priority Data: NL PCT/NL2005/000106 (2005-02-09)
Appears in Collections:(ICMA) Patentes
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