Reactive ion beam etching of aluminum indium antimonide, gallium indium antimonide heterostructures in electron cyclotron resonance methane/hydrogen/nitrogen/silicon tetrachloride discharges at room temperature

Abstract

Reactive ion beam etching of aluminum indium antimonide, gallium indium antimonide heterostructures in electron cyclotron resonance plasma using methane/hydrogen/nitrogen/silicon tetrachloride (CH4/H2/N2/SiCl4) mixtures has been performed at room temperature. Due to the ratio of chlorine to methane, formation of an indium chloride layer on the etched surface is avoided, thus resulting, in etched surfaces as smooth as the original ones and flat mesa sidewalls. Infrared diodes (2.3µm) have been fabricated using this etching technology.