Metal/biopolymer interface for packing application

Abstract

Wheat gluten (WG), one of key biopolymers, has shown great potential to substitute some of the synthetic counterparts in terms of excellent foaming ability, oxygen barrier and mechanical properties. Their availability from renewable resources, biodegradable, and less energy consumption during the manufacture are suitable for packing applications. Modern packaging industry, especially the food packaging, gradually turns to a complicated material design with a multilayer structure and nanocomposite components. In this study, we investigate the interfacial structures between chemical treated WG and noble metal thin films (i.e. Au and Ag) prepared by radio frequency sputter deposition. The WG chemical structure was investigated via IR spectroscopy. Grazing incidence small angle scattering technique was used to follow the entire thin film development of Au and Ag on top of WG in real-time. Acid and base treatment renders different WG film structure. It further causes the different growth mode of noble metals on top of both. Doping effects of acid and basic additives may play as a role of the driving forces behind.