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dc.contributor.authorWilson, Adam Andrew-
dc.contributor.authorBorca Tasciuc, Theodorian-
dc.contributor.authorMartín-González, Marisol-
dc.contributor.authorCaballero-Calero, Olga-
dc.contributor.authorMuñoz Rojo, Miguel-
dc.date.accessioned2016-09-07T06:56:48Z-
dc.date.available2016-09-07T06:56:48Z-
dc.date.issued2013-12-
dc.identifier.citationMRS Fall Meeting & Exhibit (2013)-
dc.identifier.urihttp://hdl.handle.net/10261/136417-
dc.descriptionComunicación presentada en el 2013 Materials Research Society Fall Meeting & Exhibit (MRS), celebrado en boston del 1 al 6 de diciembre de 2013.-
dc.description.abstractCharacterization of the thermoelectric properties of films is of high interest because thru nano-structuring, the figure of merit (ZT) may be enhanced. The figure of merit depends of three properties: the electrical conductivity, thermal conductivity and Seebeck coefficient. Suppression of the thermal conductivity and/or enhancement in the Seebeck coefficient leads to a higher figure of merit. As these feats are being attempted, the importance of robust, versatile, and fast measurement techniques is paramount for the advancement of the field. The scanning hot probe method allows for characterization of the thermal conductivity and Seebeck coefficient of both bulk and thin film materials. This work emphasizes characterization of films at room temperature, specifically super lattices and nanowires. This method utilizes a tip from a scanning thermal microscope (SThM), locally heating the sample and causing a temperature gradient to be induced on the sample surface. Heat diffusion models allow for the calculation of the temperature rise on the sample and the thermal resistance of the film, from which the Seebeck coefficient and thermal conductivity of the film can be readily obtained.-
dc.rightsclosedAccess-
dc.titleScanning Hot Probe Technique for Thermoelectric Characterization of Films-
dc.typecomunicación de congreso-
dc.date.updated2016-09-07T06:56:49Z-
dc.description.versionPeer Reviewed-
dc.language.rfc3066eng-
dc.relation.csic-
Appears in Collections:(IMN-CNM) Comunicaciones congresos
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